Author ：Iflowpower – Portable Power Station Supplier
Battery crack is a field of threat module performance in recent years. In some projects, cracks have been proven to result in up to 9% performance loss, which is enough to harm profitability. Cracking is due to excessive thermal stress or mechanical stress in the module, during manufacture, transportation and handling, even after deployment.
In fact, for most tests, cracks are often too small and cannot be detected, and grow over time to reduce module performance, which makes the situation more complex. Component reliability expert PVEVOLUTIONLABS (PVEL) is placed together in more than 40 components of most commercial technologies through strict stress testing to better understand the possibility of cracks and affect field performance. Some of their observations are published in a new white paper.
The conclusion of this paper is that the behavior of each module is different, and a specific material list (BOM) is the only way to determine their sensitivity. However, PVEL test also reveals interesting trends in new technologies and cracking risks. Excellent white paper found that some of the latest technological trends help to reduce risk-related risks - currently more than 80% of the single crystal batteries are not easily affected, and recently introduced multi-female interconnections reduce cracking on the module The possibility of forming an inactive region.
After the mechanical stress test of PVEL, the fork finger back contact module, glass and film technique have almost no cracking. The semi-cutting technology also shows that the cracking risk is reduced by more uniform distribution of pressure on a smaller surface, provided that the formation of microcracks is avoided during the groove cutting process. Another trend revealed in the new risk test is that a larger module surface area is often equal to more cracks - this is a highly relevant discovery, considering switching to a larger format, continue to be manufactured in module.
PVEL warnings that whether it is a wafer or module, a larger surface area means that more deflection is generated under high load, and there is a greater cracking risk. High-density interconnect technology reduces the gap between batteries and increases mechanical stress on a single battery. The white paper provides an example in which two modules 120 and 144 units, otherwise have the same BOM, and the 144 unit version shows significantly more cracking.
They also pointed out that storm, temperature changes, and other weather conditions may result in on-site cracking, and the increase in extreme weather events in many regions further increase the risk of cracking, and other damage caused by the field module. The PVEL expert concluded that "the sensitivity of crack is subtle. Some new technologies are not too easy to crack, but some old technologies may be better than new technologies.
Crack sensitivity ultimately depends on specific components and manufacturing techniques used in photovoltaic components. "Laboratory plan continues to test, there will be nearly 100 new materials list next year. .
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